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ICME CME 2013 Exhibition Call for Participants

Please Download Exhibition Request Form Here in MS WORD or PDF

The 2013 International Conference on Complex Medical Engineering (CME 2013), to be held at  Beijing Friendship Hotel, Beijing, China on May 25 - May 28, 2013, would like to invite companies, publishers and researchers to participate in the conference exhibition. With anticipated 700 conference attendees from universities, industries, and government agencies worldwide, CME 2013 provides a good opportunity for companies to advertise the products, sell books, and to increase the visibility of their organizations.

The CME 2013 is pleased to offer the following services:

A. Offer exhibition booth space for product demo.

B. List (B/W) logo/name of the company in the program digest.

C. Print (color) logo of the company on the back cover of the program book (limited to 20 companies).

D. Include one-page advertisement flyer in registration packages.

The rates for the above services are as follows:

Services

Confirm and pay before April 1, 2013

Confirm and pay after April 1, 2013

A*

US$1,200 or RMB 8,500 or JP¥120,000

US$1500 or RMB 10,000 or JP¥150,000

B

US$450 or RMB 3,000 or JP¥45,000

US$650 or RMB 4,500 or JP¥65,000

C

US$500 or RMB 3,500 or JP¥50,000 per logo

US$700 or RMB 5,000 or JP¥70,000 per logo

D

D1

US$650 or RMB4,500 or JP¥65,000 (prints provided by the company)

US$800 or RMB5,500 or JP¥80,000 (prints provided by the company)

D2

Printing services: US$500 or RMB3,500 or JP¥50,000 (1000 B/W prints by ICME CME 2013)

*A: Provide power, spaces with 3mX3m for product demo.

Deadline for submission of materials

l For services A, we Provide power, spaces with 3m x 3m for product demo.

l For services B and C, the companies must provide logos (PDF file) before April 20, 2013 to be included in the program digest. We will NOT accept any new or unpaid commitments after April 20, 2013.

l For service D, the company prepares 1000 (tentative) one-page flyers and ships them to the conference site before May 10, 2013. If more than 1000 prints are needed, we will provide an update when the exact registration number is available. If the company would like the CME 2013 to offer printing services, a one-page flyer in PDF format must be provided no later than May 1, 2013.  

If you have any questions, please contact secretariat or exhibition chair.

Shuxiang Guo: cme2013@biomecha.eng.kagawa-u.ac.jp

Qin Li: liqin@bit.edu.cn

Payment methods

Outside the Mainland China

Money Transfer Payment in US$ or JP¥ from outside of the Mainland China: Please add the total application payments in US dollars or Japanese yen and make transfer payment to THE HYAKUJUSHI BANK, LTD (Swift Code: HYAKJPJT), Nishi Branch (Branch No.204) with Account Number: 0808211 and Account Holder: CME 2013 SHUXIANG GUO (Address:1-24-47 Ougimachi, Takamatsu, Kagawa, Japan). Please indicate contact name and attention: ICME CME 2013 Exhibits.

Competed exhibition request form with payment or payment proof form must be sent to: Prof. Shuxiang Guo, Faculty of Engineering, Kagawa University.

by

Fax: +81-87-864-2369

or

E-mail: Registrationcme2013@biomecha.eng.kagawa-u.ac.jp.

Inside the Mainland China

The payment should be made to Beijing Institute of Technology by bank transfer to the following account:

Account Name: Life Eletronics Society, Chinese Institute of Electronics

Account Number: 0200004609014467164

Bank Name: Gongzhufen Sub-branch, Industrial and Commercial Bank of China Beijing Municipal Branch

Money Transfer Payment in Renminbi from inside the Mainland China (中国国内人民币转账的付款方式):请通过银行将上面费用的人民币总额汇款或转账至:中国电子学会生命电子学分会,银行账号:0200004609014467164; 开户银行:中国工商银行北京公主坟支行。汇款时请注明 "ICME CME 2013 Exhibits" .联系电话:010-68918255;传真:010-68918255;电子邮件:Registrationcme2013@biomecha.eng.kagawa-u.ac.jp.

Competed exhibition request form with payment or payment proof from inside the Mainland China must be sent to (中国国内单位请将申请表和付款证明寄往):北京市海淀区中关村南大街5号, 北京理工大学生命学院,5#教学楼725室CME 2013会务组. 联系电话: 010-68918255;传真: 010-68918255;电子邮件:Registrationcme2013@biomecha.eng.kagawa-u.ac.jp.